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At the recent CES event, NVIDIA CEO Jensen Huang pointed out that Samsung Electronics is facing some difficulties in the production of new AI memory chips. These new memory chips, known as High Bandwidth Memory (HBM), are crucial for the next generation of AI systems powered by NVIDIA chips. Huang mentioned at the press conference that Samsung's production speed for HBM is slower compared to its competitor SK Hynix.

Ampere Inc. has announced a significant update to its product roadmap with the launch of its flagship processor, Aurora, designed for AI acceleration and high bandwidth memory integration, aiming to greatly enhance cloud-native AI computing performance. Aurora features 512 Ampere cores, offering more than three times the performance of existing processors, specifically engineered for AI training and inference workloads, demonstrating Ampere's ambitions in the AI computing space. Aurora utilizes scalable AmpereOn technology.

Samsung's third-quarter profit is expected to decline by 80% compared to the same period last year, with the chip division facing losses. Samsung continues to cut chip production to address the global oversupply issue. However, the demand for artificial intelligence high bandwidth memory chips remains robust. The mobile division shows decent performance in the third quarter, driven by the new foldable smartphones. Analysts predict that demand for memory chips may start to recover as early as early next year.